Method of manufacturing display device and manufacturing device for display device

ABSTRACT

A method of manufacturing a display device includes: providing a first substrate, a second substrate, and a plurality of connection lines, wherein the first substrate has a base substrate, wherein the second substrate faces the first substrate, and wherein the plurality of connection lines are disposed between the base substrate and the second substrate; grinding a side surface of the base substrate, a side surface of the second substrate, and side surfaces of the plurality of connection lines; and simultaneously transferring a conductive film and laser-curing the conductive film, wherein the conductive film is transferred to the ground side surface of the base substrate, the ground side surface of the second substrate, and the ground side surfaces of the plurality of connection lines.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.16/895,360 filed on Jun. 8, 2020, which claims priority under 35 U.S.C §119 to Korean Patent Application No. 10-2019-0108371 filed on Sep. 2,2019 in the Korean Intellectual Property Office, the disclosures ofwhich are incorporated by reference herein in their entireties.

TECHNICAL FIELD

The present invention relates to a manufacturing device for a displaydevice and a method of manufacturing a display device.

DISCUSSION OF THE RELATED ART

Display devices, which display moving images and still images, may notonly be used in portable electronic devices, such as mobile phones,smartphones, tablet personal computers (PCs), smart watches, watchphones, mobile communication terminals, electronic notebooks, electronicbooks, portable multimedia players (PMPs), navigation devices,ultra-mobile PCs (UMPCs), and the like, but ay also be used as displayscreens for various products such as televisions (TVs), laptopcomputers, monitors, billboards, and Internet of Things (IoT) devices,and the like.

To drive light-emitting devices of a display device, a printed circuitboard (PCB) including driver circuits, a plurality of lead lines whichelectrically connect the light-emitting devices, and a plurality of leadlines connected to the plurality of signal lines may be used. Thedisplay device may include a display region, which displays images, anda portion (e.g., a bezel), which surrounds the display region and doesnot display the images. Generally, to realize a bezel-less displaydevice, the signal lines and the lead lines may be side-bonded to a sidesurface of the display device.

SUMMARY

According to an exemplary embodiment of the present invention, a methodof manufacturing a display device includes: providing a first substrate,a second substrate, and a plurality of connection lines, wherein thefirst substrate has a base substrate, wherein the second substrate facesthe first substrate, and wherein the plurality of connection lines aredisposed between the base substrate and the second substrate; grinding aside surface of the base substrate, a side surface of the secondsubstrate, and side surfaces of the plurality of connection lines; andsimultaneously transferring a conductive film and laser-curing theconductive film, wherein the conductive film is transferred to theground side surface of the base substrate, the ground side surface ofthe second substrate, and the ground side surfaces of the plurality ofconnection lines.

In an exemplary embodiment of the present invention, the transferring ofthe conductive film includes forming the conductive film on the groundside surface of the base substrate, the ground side surface of thesecond substrate, and the ground side surfaces of the plurality ofconnection lines, and compressing the conductive film.

In an exemplary embodiment of the present invention, the compressing ofthe conductive film is performed using a transparent compression tooldisposed on the conductive film.

In an exemplary embodiment of the present invention, the transparentcompression tool includes quartz or glass.

In an exemplary embodiment of the present invention, the laser-curing ofthe conductive film is performed with a projection of laser beamspassing through the transparent compression tool.

In an exemplary embodiment of the present invention, the laser-curing ofthe conductive film is performed using a continuous-wave laser supplydevice.

In an exemplary embodiment of the present invention, during thelaser-curing of the conductive film, the laser beams are focused at afront surface of the conductive film.

In an exemplary embodiment of the present invention, during thelaser-curing of the conductive film, the laser beams are focused at aregion of the conductive film, and the laser-curing is performed whilechanging a focal position of the laser beams.

In an exemplary embodiment of the present invention, the conductive filmincludes: a conductive layer disposed on the ground side surface of thebase substrate, the ground side surface of the second substrate, and theground side surfaces of the plurality of connection lines; and aprotective layer disposed on the conductive layer.

In an exemplary embodiment of the present invention, the method furtherincludes delaminating the protective layer from one surface of theconductive layer after the transferring and the laser-curing of theconductive film.

In an exemplary embodiment of the present invention, the method furtherincludes patterning the conductive layer and forming a plurality ofconnection pads disposed separately from each other in one directionafter the delaminating of the protective layer from the one surface ofthe conductive layer.

In an exemplary embodiment of the present invention, the method furtherincludes bonding a printed circuit board onto the plurality ofconnection pads after the forming of the plurality of connection pads.

In an exemplary embodiment of the present invention, the bonding of theprinted circuit board onto the plurality of connection pads includesarranging the printed circuit board on the plurality of connection padsand simultaneously compressing the arranged printed circuit board andlaser-bonding the printed circuit board to the plurality of connectionpads, wherein the compressing of the arranged printed circuit board isperformed using a transparent compression tool disposed on the printedcircuit board.

In an exemplary embodiment of the present invention, the laser-bondingof the printed circuit board to the plurality of connection pads isperformed with a projection of laser beams passing through thetransparent compression tool, wherein the laser-bonding of the printedcircuit board to the plurality of connection pads includes curing ananisotropic conductive film disposed between lead lines of the printedcircuit board and the connection pads.

In an exemplary embodiment of the present invention, during thesimultaneously transferring and laser-curing of the conductive film onthe ground side surface of the base substrate, the ground side surfaceof the second substrate, and the ground side surfaces of the pluralityof connection lines, the conductive film extends to a first surface ofthe base substrate, and the transferring and laser-curing of theconductive film is performed on the first surface of the base substrate.

According to an exemplary embodiment of the present invention, amanufacturing device for a display device including: a grinderconfigured to grind a side surface of a base substrate, a side surfaceof a second substrate, and side surfaces of a plurality of connectionlines disposed between the base substrate and the second substrate; anda conductive-film transfer unit and a conductive-film curing unitconfigured to simultaneously transfer a conductive film to andlaser-cure the conductive film on the ground side surface of the basesubstrate, the ground side surface of the second substrate, and theground side surfaces of the plurality of connection lines. Theconductive film includes a conductive layer and a protective layerdisposed on the conductive layer.

In an exemplary embodiment of the present invention, the conductive-filmtransfer unit compresses the conductive film formed on the ground sidesurface of the base substrate, the ground side surface of the secondsubstrate, and the ground side surfaces of the plurality of connectionlines.

In an exemplary embodiment of the present invention, the conductive-filmtransfer unit includes a compression tool disposed on the conductivefilm, and the compression tool includes quartz or glass.

In an exemplary embodiment of the present invention, the conductive-filmcuring unit includes a first laser supply device, wherein the firstlaser supply device projects continuous-wave laser beams through thecompression tool and cures the conductive film.

In an exemplary embodiment of the present invention, the device furtherincluding: a patterning laser configured to pattern the conductive layerand form connection pads; and a chip-on film bonding unit configured tobond a printed circuit board onto the connection pads, wherein thechip-on film bonding unit includes: a compression unit configured tocompress a chip-on film and including a compression tool includingquartz or glass; and a second laser supply device configured to projectlaser beams through the compression unit and to cure an anisotropicconductive film disposed between lead lines of the printed circuit boardand the connection pads.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present disclosure will become moreapparent by describing exemplary embodiments thereof in detail withreference to the accompanying drawings, in which:

FIG. 1 is a flowchart illustrating a method of manufacturing a displaydevice according to an exemplary embodiment of the present invention;

FIGS. 2, 3, 5, 8, and 10 are perspective views illustrating processoperations of a method of manufacturing a display device according to anexemplary embodiment of the present invention;

FIG. 4 is a cross-sectional view taken along line IV-IV′ of FIG. 3 ;

FIG. 6 is a cross-sectional view taken along line V-V′ of FIG. 5 ;

FIG. 7 is a cross-sectional view illustrating the delamination of aprotective film shown in FIG. 6 ;

FIG. 9 is a cross-sectional view taken along line VII-VII′ of FIG. 8 ;

FIG. 11 is a cross-sectional view taken along line IX-IX′ of FIG. 9 ;

FIG. 12 is an enlarged cross-sectional view of region A of FIG. 11 ;

FIG. 13 is a table showing comparisons between simultaneous operationsof transferring a conductive film and laser-curing the conductive filmand sequential operations of transferring a conductive film andlaser-curing the conductive film;

FIG. 14 is a perspective view of one process operation of a method ofmanufacturing a display device according to an exemplary embodiment ofthe present invention;

FIG. 15 is a perspective view of one process operation of a method ofmanufacturing a display device according to an exemplary embodiment ofthe present invention;

FIG. 16 is a perspective view of one process operation of a method ofmanufacturing a display device according to an exemplary embodiment ofthe present invention;

FIG. 17 is a block diagram of a manufacturing device for a displaydevice according to an exemplary embodiment of the present invention;and

FIG. 18 is a block diagram of a chip-on film (COF) bonding unitaccording to an exemplary embodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Exemplary embodiments of the present invention will now be describedmore fully hereinafter with reference to the accompanying drawings. Thispresent invention may, however, be embodied in different forms andshould not be construed as limited to the exemplary embodiments setforth herein.

It will be understood that when an element or layer is referred to asbeing “above” or “on” another element or layer, the element or layer canbe directly on another element or layer or intervening layers orelements may be present therebetween.

The same reference numerals may denote the same elements throughout thespecification, and thus repetitive descriptions may be omitted.

Hereinafter, exemplary embodiments of the present invention will bedescribed with reference to the accompanying drawings.

FIG. 1 is a flowchart illustrating a method of manufacturing a displaydevice according to an exemplary embodiment of the present invention.FIGS. 2, 3, 5, 8, and 10 are perspective views illustrating processoperations of a method of manufacturing a display device according to anexemplary embodiment of the present invention. FIG. 4 is across-sectional view taken along line IV-IV′ of FIG. 3 . FIG. 6 is across-sectional view taken along line V-V′ of FIG. 5 . FIG. 7 is across-sectional view illustrating the delamination of a protective filmshown in FIG. 6 . FIG. 9 is a cross-sectional view taken along lineVII-VII′ of FIG. 8 . FIG. 11 is a cross-sectional view taken along lineIX-IX′ of FIG. 9 . FIG. 12 is an enlarged cross-sectional view of regionA of FIG. 11 .

Referring to FIGS. 1 to 12 , the method of manufacturing a displaydevice according to the exemplary embodiment of the present inventionmay include providing a first substrate including a base substrate, asecond substrate facing the first substrate, and a plurality ofconnection lines disposed between the base substrate and the secondsubstrate (S10). The method of manufacturing the display device mayfurther include grinding a side surface of the base substrate, a sidesurface of the second substrate, and side surfaces of the plurality ofconnection lines (S20), and simultaneously transferring a conductivefilm onto the ground side surface of the base substrate, the ground sidesurface of the second substrate, and the ground side surfaces of theplurality of connection lines and laser-curing the conductive film(S30). The method further includes patterning the conductive film toform a plurality of connection pads disposed separately from each otherin one direction (S40), and bonding a printed circuit board (PCB) on theplurality of connection pads (S50).

Referring to FIGS. 1 and 2 , a first substrate 100, a second substrate200 facing the first substrate 100, and a plurality of connection lines110. In addition, the first substrate 100 includes a first basesubstrate SUB1, and the plurality of connection lines 110 are disposedbetween the first base substrate SUB1 and the second substrate 200 maybe provided (S10).

The display device according to an exemplary embodiment of the presentinvention may include target panels 100 and 200.

The target panels 100 and 200 may respectively include the firstsubstrate 100 and the second substrate 200. In addition, the targetpanels 100 and 200 may respectively include various elements disposed onthe first substrate 100 and various elements disposed on the secondsubstrate 200.

In an exemplary embodiment of the present invention, the target panels100 and 200 may respectively be the first substrate 100 and the secondsubstrate 200.

The target panels 100 and 200 may each include, for example, an organiclight-emitting display panel. Although the following embodimentsillustrate a case in which the target panels 100 and 200 each includethe organic light-emitting display panel, the present invention is notlimited thereto. For example, the target panels 100 and 200 may includeother kinds of display panels such as a liquid crystal display (LCD), aquantum-dot organic light emitting diode (QD-OLED) panel, a quantum-dotLCD (QD-LCD), a quantum nano light-emitting diode (nano LED) panel, anda micro LED.

The various elements of the first substrate 100 may include a pluralityof insulating layers, a plurality of conductive layers, at least onethin-film transistor (TFT), and an organic light-emitting elementconnected to the at least one TFT.

For example, the first substrate 100 may be a back plate substrateincluding the at least one TFT or a TFT substrate.

The second substrate 200 may face the first substrate 100 and disposedover the first substrate 100. The second substrate 200 may include anencapsulation substrate which encapsulates the organic light-emittingelement of the first substrate 100.

Each of the first substrate 100 and the second substrate 200 may includea base substrate. Each of the base substrates of the first substrate 100and the second substrate 200 may include a rigid material such as glassor quartz. For example, the first substrate 100 may include a first basesubstrate SUB1.

The first substrate 100 may further include the connection lines 110disposed between the first base substrate SUB1 and the second substrate200.

The target panels 100 and 200 may each have a rectangular shape of whichcorners are a right angle in a plan view. However, the present inventionis not limited thereto; for example, the target panels 100 and 200 mayeach have a polygonal shape and may have rounded corners. The targetpanels 100 and 200 may each have long sides and short sides in a planview. The short sides of the target panels 100 and 200 may be sidesextending in a second direction DR2. The long sides of the target panels100 and 200 may be sides extending in a first direction DR1. The firstsubstrate 100 may have substantially the same planar shape as the secondsubstrate 200.

Thereafter, referring to FIGS. 1 and 2 , one (e.g., first) side surfaceSUB1 s of the first base substrate SUB1, one (e.g., first) side surface200 s of the second substrate 200, and side surfaces (e.g., first sidesurfaces) 110 s of the plurality of connection lines 110 may be ground(S20).

As a result, side surface portions (e.g., upper short side surfaceportions in a first direction DR1) of the first substrate 100 and thesecond substrate 200 may be ground, and thus one side surface of thefirst substrate 100 and one side surface 200S of the second substrate200 may be arranged in a direction (e.g., a third direction DR3) inwhich the second substrate 200 is viewed from the first substrate 100.Regarding other side surface portions (lower short side surface portionsin the first direction DR1 and extending in the second direction DR2,first long side surface portions of one side in a second direction DR2and extending in the first direction DR1, and second long side surfaceportions of the other side (e.g., opposing the first long side surfaceportions) in the second direction DR2 and extending in the firstdirection DR1) of the first substrate 100 and the second substrate 200,side surfaces of the first substrate 100 and the second substrate 200may be arranged in a thickness direction (e.g., the third directionDR3), but the present invention is not limited thereto.

Hereinafter, the ground one side surface of the first substrate 100 andthe ground one side surface 200 s of the second substrate 200 will berespectively referred to as a first side surface of the first substrate100 and a first side surface of the second substrate 200.

The connection lines 110 may pass from a display region of the firstsubstrate 100 through a non-display region (or, e.g., an upper shortside surface of the first substrate 100 in the first direction DR1).However, the present invention is not limited thereto, and for example,the connection lines 110 may extend from the display region of the firstsubstrate 100 to a long side surface of the first substrate 100. Theconnection line 110 may be electrically connected to a pixel of thedisplay region. The connection line 110 may extend to the first sidesurface of the first substrate 100 and the first side surface 200 s ofthe second substrate 200, and thus, the first side surface 110 s of theconnection line 110 and the first side surface of the first substrate100 and the first side surface 200 s of the second substrate 200 may bearranged in a thickness direction. In other words, the first substrate100, the connection lines 110, and the second substrate 200 are arrangedin the third direction DR3.

Like the first substrate 100 including the first side surface, the firstbase substrate SUB1 of the first substrate 100 may include the firstside surface SUB1 s. For example, the first side surface SUB1 s may be apart of the first side surface of the first substrate 100. The firstside surface SUB1 s of the first base substrate SUB1, the first sidesurface 110 s of the connection line 110, and the first side surface 200s of the second substrate 200 may be arranged with each other in thethird direction DR3.

A plurality of connection lines 110 may be provided. The plurality ofconnection lines 110 may be disposed to be spaced apart from each otherin the second direction DR2. Although only four connection lines 110 areillustrated, five or more connection lines 110 may be provided.

The connection line 110 may include at least one metal such asmolybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver(Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium(Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta),tungsten (W), and/or copper (Cu).

Like the first side surface of the first substrate 100, the connectionline 110 disposed on the first substrate 100 may include the first sidesurface 110 s. The first side surface 110 s of the connection line 110and the first side surface 200 s of the second substrate 200 may bearranged with each other in the third direction DR3.

Like the first substrate 100 including the first side surface, the firstbase substrate SUB1 of the first substrate 100 may include the firstside surface SUB1 s. The first side surface 110 s of the connection line110, the first side surface 200 s of the second substrate 200, and thefirst side surface SUB1 s of the first base substrate SUB1 may bearranged with each other in the third direction DR3.

Operation S20 of grinding one side surface SUB1 s of the first basesubstrate SUB1, one side surface 200 s of the second substrate 200, andthe first side surfaces 110 s of the plurality of connection lines 110may be performed using a grinding device 600 shown in FIG. 2 . Thegrinding device 600 may be disposed on one side surface SUB1 s of thefirst base substrate SUB1, one side surface 200 s of the secondsubstrate 200, and the side surfaces 110 s of the plurality ofconnection lines 110, and may grind one side surface SUB1 s is of thefirst base substrate SUB1, one side surface 200 s of the secondsubstrate 200, and the side surfaces 110 s of the plurality ofconnection lines 110 while moving in one direction. The grinding device600 may include, for example, a wheel device. The wheel device may havea circular planar shape based on the plane formed by the first directionDR1 and the second direction DR2. For example, a side surface of thegrinding device 600 may be parallel to the first side surface SUB1 s ofthe first base substrate SUB1, the first side surface 200 s of thesecond substrate 200, and the first side surfaces 110 s of the pluralityof connection lines 110. The wheel device having a circular planar shapemay have a central shaft facing the second direction DR2 and circularlyrotate to grind one side surface SUB1 s is of the first base substrateSUB1, one side surface 200 s of the second substrate 200, and the sidesurfaces 110 s of the plurality of connection lines 110. For example,the central shaft may extend in the second direction DR2.

The first base substrate SUB1 may include a first surface SUB1 a facingthe second substrate 200 and a second surface SUB1 b opposite to thefirst surface SUB1 a of the first base substrate SUB1. The secondsubstrate 200 may include a first surface 200 a facing the firstsubstrate 100 and a second surface 200 b opposite to the first surface200 a.

Thereafter, referring to FIGS. 1 and 3 to 6 , a conductive film 120 amay be simultaneously transferred to the ground first side surface ofthe first substrate 100, the ground first side surface 200 s of thesecond substrate 200, and the ground first side surfaces 110 s of theplurality of connection lines 110, and a laser curing process may beperformed (S30). For example, the conductive film 120 a may betransferred to the ground first side surface SUB1 s of the basesubstrate SUB1.

As shown in FIG. 3 , the operation of transferring the conductive film120 a to the ground first side surface of the first substrate 100, theground first side surface 200 s of the second substrate 200, and theground first side surfaces 110 s of the plurality of connection lines110 may include arranging the conductive film 120 a on the ground firstside surface of the first substrate 100, the ground first side surface200 s of the second substrate 200, and the ground first side surfaces110 s of the plurality of connection lines 110.

As shown in FIG. 4 , the conductive film 120 a may include a conductivelayer 120 a ₁ and a protective layer 120 a ₂ disposed on the conductivelayer 120 a ₁. Before the conductive film 120 a is arranged on theground first side surface of the first substrate 100 (e.g., the groundfirst side surface SUB1 s of the first base substrate SUB1), the groundfirst side surface 200 s of the second substrate 200, and the groundfirst side surfaces 110 s of the plurality of connection lines 110, theconductive film 120 a may further include a release film, which isspaced apart from the protective layer 120 a ₂ with the conductive layer120 a ₁ disposed therebetween. For example, the release film may bedisposed on a bottom surface of the conductive layer 120 a ₁. When therelease film is arranged on the ground first side surface of the firstsubstrate 100, the ground first side surface 200 s of the secondsubstrate 200, and the ground first side surfaces 110 s of the pluralityof connection lines 110, the release film may be delaminated and removedfrom the conductive layer 120 a ₁.

The conductive layer 120 a ₁ may be disposed on the first side surfaceof the first substrate 100, the first side surface 200 s of the secondsubstrate 200, and the first side surfaces 110 s of the plurality ofconnection lines 110. The conductive layer 120 a ₁ may be directlydisposed on the first side surface of the first substrate 100, the firstside surface 200 s of the second substrate 200, and the first sidesurfaces 110 s of the plurality of connection lines 110. As anadditional example, the conductive layer 120 a ₁ may be disposed on thefirst side surface SUB1 s of the first base substrate SUB1. Theconductive layer 120 a ₁ may include a conductive material. Theconductive material may include at least one of silver (Ag), copper(Cu), and/or gold (Au). The conductive layer 120 a ₁ according to anexemplary embodiment of the present invention may include silver.

The conductive film 120 a may be formed over the entire surfaces on theground first side surface of the first substrate 100, the ground firstside surface 200 s of the second substrate 200, and the ground firstside surfaces 110 s of the plurality of connection lines 110. As anadditional example, the conductive layer 120 a ₁ may be formed over theground first side surface SUB1 s of the first base substrate SUB1.

The protective layer 120 a ₂ may include a material that may betypically used as a base material. The protective layer 120 a ₂ mayinclude, for example, polyethylene terepthalate (PET), but the presentinvention is not limited thereto.

Referring to FIG. 5 , an operation of transferring a conductive film 120a to the ground first side surface of the first substrate 100, theground first side surface 200 s of the second substrate 200, and theground first side surfaces 110 s of the plurality of connection lines110 may further include compressing the conductive film 120 a andforming a conductive film 120 b having a substantially constantthickness after the operation of arranging the conductive film 120 a. Asshown in FIG. 6 , the conductive film 120 b may include a conductivelayer 120 a _(1_) 1 and a protective layer 120 a ₂ disposed on theconductive layer 120 a _(1_) 1.

The operation of compressing the conductive film 120 a and forming theconductive film 120 b having the substantially constant thickness may beperformed using a transparent compression tool 700 disposed on theconductive film 120 a. The transparent compression tool 700 may bedirectly disposed on the protective layer 120 a ₂ of the conductive film120 b.

The transparent compression tool 700 may include a transparent materialsuch as quartz or glass. For example, the compression tool 700 may be ablock made of quartz, glass or the like.

The conductive film 120 a formed on the ground first side surface of thefirst substrate 100, the ground first side surface 200 s of the secondsubstrate 200, and the ground first side surfaces 110 s of the pluralityof connection lines 110 may be compressed downward in the firstdirection DR1 using the transparent compression tool 700. The conductivelayer 120 a _(1_) 1 of the compressed conductive film 120 b mayuniformly spread in the second direction DR2 and the third direction DR3and have a substantially constant thickness in the first direction DR1.

In the method of manufacturing a display device according to anexemplary embodiment of the present invention, the operation oftransferring the conductive film 120 b to the ground first side surfaceof the first substrate 100, the ground first side surface 200 s of thesecond substrate 200, and the ground first side surfaces 110 s of theplurality of connection lines 110 may be performed substantiallysimultaneously with the operation of laser-curing the conductive film120 a on the ground first side surface of the first substrate 100, theground first side surface 200 s of the second substrate 200, and theground first side surfaces 110 s of the plurality of connection lines110.

As shown in FIG. 5 , the operation of laser-curing the conductive film120 a may be performed such that laser beams are projected to passthrough the transparent compression tool 700.

It will be understood that when the operation of transferring theconductive film 120 b to the ground first side surface of the firstsubstrate 100, the ground first side surface 200 s of the secondsubstrate 200, and the ground first side surfaces 110 s of the pluralityof connection lines 110, the operation is referred to as being performedsubstantially simultaneously with the operation of laser-curing theconductive film 120 a on the ground first side surface of the firstsubstrate 100, the ground first side surface 200 s of the secondsubstrate 200, and the ground first side surfaces 110 s of the pluralityof connection lines 110. An operation of forming the conductive film 120a may be performed first, and then the operation of compressing theconductive film 120 a, which is formed on the ground first side surfaceof the first substrate 100, the ground first side surface 200 s of thesecond substrate 200, and the ground first side surfaces 110 s of theplurality of connection lines 110, downward in the first direction DR1using the transparent compression tool 700 may be performedsubstantially simultaneously with the operation of laser-curing theconductive film 120 a on the ground first side surface of the firstsubstrate 100, the ground first side surface 200 s of the secondsubstrate 200, and the ground first side surfaces 110 s of the pluralityof connection lines 110.

For example, the operation of compressing the conductive film 120 a,which is formed on the ground first side surface of the first substrate100, the ground first side surface 200 s of the second substrate 200,and the ground first side surfaces 110 s of the plurality of connectionlines 110, downward in the first direction DR1 using the transparentcompression tool 700 may be performed before or after the operation oflaser-curing the conductive film 120 a on the ground first side surfaceof the first substrate 100, the ground first side surface 200 s of thesecond substrate 200, and the ground first side surfaces 110 s of theplurality of connection lines 110 in a temporal sequence.

For example, the operation of compressing the conductive film 120 a,which is formed on the ground first side surface of the first substrate100, the ground first side surface 200 s of the second substrate 200,and the ground first side surfaces 110 s of the plurality of connectionlines 110, downward in the first direction DR1 using the transparentcompression tool 700 and simultaneously curing the conductive film 120 asuch that laser beams are projected to pass through the transparentcompression tool 700 may be performed. However, when the laser beamsreach the conductive film 120 a by passing through the transparentcompression tool 700 and the transparent compression tool 700 compressesthe conductive film 120 a, it may also be possible that the operation ofcuring the conductive film 120 a is performed before the operation ofcompressing the conductive film 120 a in a temporal sequence. However,even if the operations are performed in the temporal sequence, since theoperation of compressing the conductive film 120 a using the transparentcompression tool 700 is performed during the same process as theoperation of curing the conductive film 120 a using laser beams thathave effectively transmitted through the transparent compression tool700, the two operations are performed substantially simultaneously.

The operation of laser-curing the conductive film 120 a may be performedusing a first laser supply device 800. The first laser supply device 800may be a continuous wave (CW) laser supply device.

The operation of laser-curing the conductive film 120 a may be performedwhen a focus of laser beams is positioned at a front surface of theconductive film 120 a, which is a front surface (e.g., a top surface)viewed in the first direction DR1. For example, a focal position of thelaser beams projected by the first laser supply device 800 may beadjusted such that the laser beams are projected onto the front surfaceof the conductive film 120 a, which is viewed in the first directionDR1.

Thereafter, referring to FIG. 7 , the protective layer 120 a ₂ may bedelaminated and removed from one surface of the conductive layer 120 a_(1_) 1. Thus, the one surface of the conductive layer 120 a _(1_) 1 maybe exposed to the outside.

Thereafter, referring to FIGS. 1, 8, and 9 , the conductive layer 120 a_(1_) 1 may be patterned to form a plurality of connection pads 120 cwhich are disposed separately from each other in one direction (S40).For example, the plurality of connection pads 120 c may be spaced apartfrom each other along the second direction DR2.

As shown in FIG. 8 , the operation S40 of forming the plurality ofconnection pads 120 c, which are disposed separately from each other inone direction, by patterning the conductive layer 120 a _(1_) 1 may beperformed using a second laser supply device 900.

The second laser supply device 900 may be different from a CW lasersupply device. For example, laser beams projected by the second lasersupply device 900 may have a pulse generated at a constant repetitiousrate in a predetermined period of time. For example, the second lasersupply device 900 may be a short-pulse laser supply device configured toprovide short-pulse laser.

Due to the second laser supply device 900, as shown in FIG. 8 , theconductive layer 120 a 1_1 may be formed as the plurality of connectionpads 120 c disposed to be spaced apart from each other in the seconddirection DR2.

Each of the connection pads 120 c may be electrically connected to thecorresponding one of the connection lines 110 in the first directionDR1. For example, each of the connection pads 120 c may be disposed on acorresponding connection line 110.

Referring to FIGS. 1 and 10 to 12 , a printed circuit board (PCB) 300may be bonded onto the plurality of connection pads 120 c (S50).

The operation S50 of bonding the PCB 300 onto the plurality ofconnection pads 120 c may include arranging the PCB 300 on the pluralityof connection pads 120 c and compressing the arranged PCB 300 andlaser-bonding the PCB 300 to the plurality of connection pads 120 c.

The PCB 300 may include a base film 310, the plurality of connectionlines 110, and a plurality of lead lines 330, each of which correspondto and are electrically connected to one of the plurality of connectionpads 120 c. The PCB 300 may further include a driver integrated circuit(IC) 390 electrically connected to the plurality of lead lines 330.

The PCB 300 may be a flexible film such as a flexible PCB, a PCB, or achip-on film (COF).

The driver IC 390 may be, for example, a data driver IC, and a COFimplemented as a data driver chip may be applied to the driver IC 390.

Although FIG. 10 illustrates a case in which the PCB 300 is bonded onlyto the first side surfaces of the target panels 100 and 200, the presentinvention is not limited thereto. The PCB 300 may be disposed on thefirst side surfaces of the target panels 100 and 200 and at least one ofother side surfaces (e.g., the lower short side portions in the firstdirection DR1, a long side portion of one side in the second directionDR2, and a long side portion of the other side in the second directionDR2) of the target panels 100 and 200.

As shown in FIG. 10 , the operation of compressing the disposed PCB 300may be performed using a transparent compression tool 1000 disposed onthe PCB 300. The transparent compression tool 1000 may be substantiallythe same as the transparent compression tool 700 described above withreference to FIG. 5 .

Referring to FIG. 11 , an anisotropic conductive film 130 may be furtherdisposed between the lead lines 330 and the connection pads 120 c. Asshown in FIG. 12 , the anisotropic conductive film 130 may include aplurality of conductive balls 130 b configured to electrically connectthe lead lines 330 to the connection pads 120 c and an insulating resin130 a in which the plurality of conductive balls 130 b are disposed.

The operation of compressing the disposed PCB 300 may includecompressing the anisotropic conductive film 130 by pressing thetransparent compression tool 1000 downward in the first direction DR1and bonding and electrically connecting the lead lines 330 to theconnection pads 120 c.

In the method of manufacturing a display device according to anexemplary embodiment of the present invention, the operation ofcompressing the disposed PCB 300 may be performed substantiallysimultaneously with the operation of laser-bonding the disposed PCB 300to the connection pads 120 c.

The operation of laser-bonding the PCB 300 may be performed such thatlaser beams are projected to pass through the transparent compressiontool 1000.

Due to the operation of laser-bonding the PCB 300, the anisotropicconductive film 130 interposed between the PCB 300 and the connectionpads 120 c may be cured, and thus the PCB 300 may be bonded onto theconnection pads 120 c.

The operation of laser-bonding the PCB 300 may be performed using athird laser supply device 1100. The third laser supply device 1100 maybe a CW laser supply device. The third laser supply device 1100 may havesubstantially the same configuration as the first laser supply device800.

After the PCB 300 is bonded onto the connection pads 120 c, as shown inFIG. 11 , the PCB 300 may be bent onto another surface of the firstsubstrate 100 (or a second surface SUB1 b of the first base substrateSUB1). For example, the other surface of the first substrate 100 may befacing away from the second substrate 200.

In the method of manufacturing a display device according to anexemplary embodiment of the present invention, since the conductive film120 a is laser-cured, a curing rate of the conductive film 120 b (e.g.,a curing rate of the conductive layer of the conductive film 120 b) maybe higher than when the conductive film 120 a is thermally cured. Whenthe curing rate of the conductive layer is high, a resistance of theconductive layer may be lower than a resistance of a conductive layerformed using a thermal curing process.

FIG. 13 is a table showing comparisons between simultaneous operationsof transferring a conductive film and laser-curing the conductive filmand sequential operations of transferring a conductive film andlaser-curing the conductive film in terms of process specifications.

Referring to FIG. 13 , a left column represents specifications of aprocess of laser-curing a conductive film 120 a after transferring theconductive film 120 a, while a right column represents specifications ofa process of simultaneously transferring a conductive film 120 a andlaser-curing the conductive film 120 a.

To describe the left column, the transferring of the conductive film 120a was performed using a hot metal tool. During the compression of thehot metal tool, a temperature was about 100° C., a compression pressurewas about 2 kgf, and a compression time was about ten seconds. Further,the curing of the conductive film 120 a was performed using a lasersupply device having an output of about 29.6 W. An output speed of thelaser supply device was about 15 mm/s, and a process time taken for thecuring process was about four seconds.

In the right column, a compression pressure was 2 kgf, and the curing ofthe conductive film 120 a was performed using a laser supply devicehaving an output of about 35 W, and compression and curing times wereabout five seconds.

When the operations of compressing and curing the conductive film 120 awere simultaneously performed under conditions corresponding to theright column, an overall process time was reduced more than when theoperations of the compressing and curing the conductive film 120 a wereperformed separately.

Hereinafter, an exemplary embodiment of the present invention will bedescribed. In the following embodiment, the same components as in theabove-described embodiment may be denoted by the same referencenumerals, and thus descriptions thereof may be omitted or simplified forbrevity.

FIG. 14 is a perspective view of one process operation of a method ofmanufacturing a display device according to an exemplary embodiment ofthe present invention.

Referring to FIG. 14 , the method of manufacturing a display deviceaccording to the present exemplary embodiment may be different from themethod of manufacturing a display device according to the exemplaryembodiment shown in FIG. 5 in that an operation of laser-curing aconductive film 120 a. is performed using a first laser supply device800_1.

Like the first laser supply device 800 of FIG. 5 , a first laser supplydevice 800_1 may be a CW laser supply device.

During the operation of laser-curing the conductive film 120 a accordingto the present embodiment, a focus of laser beams is positioned at apartial region of the conductive film 120 a, which is viewed from afirst direction DR1. For example, a focal position of the laser beamsprojected by the first laser supply device 800_1 may be adjusted suchthat the laser beams are projected onto the partial region of theconductive film 120 a. The focal position of the laser beams of thefirst laser supply device 800_1 may be changed. For example, the focalposition of the laser beams of the first laser supply device 800_1 maybe changed such that the laser beams are projected onto a front surfaceof the conductive film 120 a.

The changed focal position may form a line shape based on the drawings,but the present invention is not limited thereto.

FIG. 15 is a perspective view of one process operation of a method ofmanufacturing a display device according to an exemplary embodiment ofthe present invention.

Referring to FIG. 15 , the method of manufacturing a display deviceaccording to the present exemplary embodiment may be different from themethod according to the exemplary embodiment shown in FIG. 5 in that aconductive film 120 b_1 extends to a second surface SUB1 b of a firstbase substrate SUB1 from the first side surface SUB1 s of the first basesubstrate SUB1. In addition, the conductive film 120 b_1 is compressedand laser-cured on the second surface SUB1 b of the first base substrateSUB1.

Hereinafter, other descriptions thereof, which are substantially thesame as in FIGS. 4 and 5 , may be omitted for brevity.

FIG. 16 is a perspective view of one process operation of a method ofmanufacturing a display device according to an exemplary embodiment ofthe present invention.

Referring to FIG. 16 , the method of manufacturing a display deviceaccording to the present exemplary embodiment may be different from themethod according to the exemplary embodiments shown in FIG. 15 in thatan operation of laser-curing a conductive film is performed using afirst laser supply device 800_1. For example, during the operation ofthe laser-curing of the conductive film, the first laser supply device800_1, shown in FIG. 16 , focuses laser beams to a partial region of theconductive film 120 b_1. Referring to FIG. 15 , the first laser supplydevice 800 provides laser beams to a surface, facing in the firstdirection DR1, of the conductive film 120 b_1.

Hereinafter, other descriptions which are substantially the same as inFIGS. 4, 5, 14 , and 15 may be omitted for brevity.

Hereinafter, a manufacturing device of a display device will bedescribed. In the following exemplary embodiment of the presentinvention, the same components as in the above-described embodiment maybe denoted by the same reference numerals, and descriptions thereof maybe omitted or simplified for brevity.

FIG. 17 is a block diagram of a manufacturing device of a display deviceaccording to an exemplary embodiment of the present invention, and FIG.18 is a block diagram of a COF bonding unit according to an exemplaryembodiment of the present invention.

The manufacturing device 1 of a display device according to theexemplary embodiment may include a grinding unit 10 (e.g., a grinder), aconductive-film transfer/curing unit 20, a laser patterning unit 30, anda COF bonding unit 40.

The grinding unit 10 may have the same configuration as the grindingdevice 600 described above with reference to FIG. 2 . Theconductive-film transfer/curing unit 20 may have components that eachare the same as a corresponding one of the transparent compression tool700 and the first laser supply device 800 of FIG. 5 . The laserpatterning unit 30 may have the same configuration as the second lasersupply device 900 of FIG. 8 . The COF bonding unit 40 may havecomponents that each are the same as a corresponding one of thetransparent compression tool 1000 and the third laser supply device 1100of FIG. 10 .

The grinding unit 10 may grind one side surface SUB1 s of a first basesubstrate SUB1, one side surface 200 s of a second substrate 200 facingthe first base substrate SUB1, and side surfaces 110 s of a plurality ofconnection lines 110 disposed between the first base substrate SUB1 andthe second substrate 200.

The conductive-film transfer/curing unit 20 may simultaneously transferand laser-cure a conductive film 120 a on the ground side surface SUB1 sof the first base substrate SUB1, the ground side surface 200 s of thesecond substrate 200 facing the first base substrate SUB1, and theground side surfaces 110 s of the plurality of connection lines 110disposed between the first base substrate SUB1 and the second substrate200. Here, the conductive film 120 a may include a conductive layer 120a ₁ and a protective layer 120 a ₂ disposed on the conductive layer 120a ₁.

A conductive-film transfer unit 20 may be formed to compress theconductive film 120 a, which is formed on the ground side surface SUB1 sof the first base substrate SUB1, the ground side surface 200 s of thesecond substrate 200 facing the first base substrate SUB1, and theground side surfaces 110 s of the plurality of connection lines 110disposed between the first base substrate SUB1 and the second substrate200. The conductive-film transfer unit 20 may include a transparentcompression tool 700 disposed on the conductive film 120 a, and thetransparent compression tool 700 may include, for example, quartz orglass.

A conductive-film curing unit 20 may include a laser supply device 800.The laser supply device 800 may be configured to project CW laser beamswhich pass through the transparent compression tool 700 to cure theconductive film 120 a.

The laser patterning unit 30 may pattern the conductive layer 120 a ₁and form connection pads 120 c. The COF bonding unit 40 may bond a PCBonto the connection pads 120 c. The COF bonding unit 40 may include acompression unit 43 configured to compress a COF (refer to PCB 300 inFIG. 10 ), and a laser supply unit 41 configured to project laser beamswhich pass through the compression unit 43 and cure an anisotropicconductive film 130 disposed between lead lines 330 of the PCB and theconnection pads 120 c. The compression unit 43 may be the same as theconductive-film transfer unit 20, and the laser supply unit 41 may bethe same as the conductive-film curing unit 20.

The method of manufacturing a display device and the manufacturingdevice for a display device according to an exemplary embodiment of thepresent invention can reduce a process time taken for a process oftransferring and curing connection pads.

Effects according to the present invention are not limited by theabove-described examples, and more various effects may be included inthe present invention.

While the present invention has been described with reference toexemplary embodiments thereof, it will be understood by those ofordinary skill in the art that various changes in form and details maybe made thereto without departing from the spirit and scope of thepresent invention.

What is claimed is:
 1. A manufacturing device for a display device, thedevice comprising: a grinder configured to grind a side surface of abase substrate, a side surface of a second substrate, and side surfacesof a plurality of connection lines disposed between the base substrateand the second substrate; and a conductive-film transfer unit and aconducive-film curing unit configured to simultaneously transfer aconductive film to and laser-cure the conductive film on the ground sidesurface of the base substrate, the ground side surface of the secondsubstrate, and the ground side surfaces of the plurality of connectionlines, wherein the conductive film comprises a conductive layer and aprotective layer disposed on the conductive layer.
 2. The device ofclaim 1, wherein the conductive-film transfer unit compresses theconductive film formed on the ground side surface of the base substrate,the ground side surface of the second substrate, and the ground sidesurfaces of the plurality of connection lines.
 3. The device of claim 2,wherein the conductive-film transfer unit comprises a compression tooldisposed on the conductive film, and the compression tool comprisesquartz or glass.
 4. The device of claim 3, wherein the conductive-filmcuring unit comprises a first laser supply device, wherein the firstlaser supply device projects continuous-wave laser beams through thecompression tool and cures the conductive film.
 5. The device of claim4, further comprising: a patterning laser configured to pattern theconductive layer and form connection pads; and a chip-on film bondingunit configured to bond a printed circuit board onto the connectionpads, wherein the chip-on film bonding unit comprises: a compressionunit configured to compress a chip-on film and comprising a compressiontool including quartz or glass; and a second laser supply deviceconfigured to project laser beams through the compression unit and tocure an anisotropic conductive film disposed between lead lines of theprinted circuit board and the connection pads.